JEDEC JEP175
DDR4 Protocol Checks
standard by JEDEC Solid State Technology Association, 07/01/2017
NACE ASAE-ASABE B11 CGA ICC CTA
DDR4 Protocol Checks
standard by JEDEC Solid State Technology Association, 07/01/2017
N-CHANNEL MOSFET HOT CARRIER DATA ANALYSIS
standard by JEDEC Solid State Technology Association, 09/01/2001
INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – NATURAL CONVECTION (STILL AIR)
standard by JEDEC Solid State Technology Association, 01/01/2007
DEFINITION OF THE SSTUB32869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
standard by JEDEC Solid State Technology Association, 01/01/2013
CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERS
standard by JEDEC Solid State Technology Association, 12/01/2011
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
standard by JEDEC Solid State Technology Association, 03/01/2009
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
standard by JEDEC Solid State Technology Association, 08/01/2018
Joint JEDEC/ECA Standard: Definition of "Low-Halogen" for Electronic Products
standard by JEDEC Solid State Technology Association, 04/01/2015
DEFINITION OF THE SSTUB32868 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 10/01/2006
JOINT JEDEC/ECA STANDARD, DEFINING "LOW-HALOGEN" PASSIVES AND SOLID STATE DEVICES (Removal of BFR/CFR/PVC)
standard by JEDEC Solid State Technology Association, 08/01/2011
NUMBERING OF LIKE-NAMED TERMINAL FUNCTIONS IN SEMICONDUCTOR DEVICES AND DESIGNATION OF UNITS IN MULTIPLE-UNIT SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 02/01/1987