JEDEC JESD51-13
Glossary of Thermal Measurement Terms and Definitions
standard by JEDEC Solid State Technology Association, 06/01/2009
NACE ASAE-ASABE B11 CGA ICC CTA
Glossary of Thermal Measurement Terms and Definitions
standard by JEDEC Solid State Technology Association, 06/01/2009
GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
standard by JEDEC Solid State Technology Association, 01/01/2008
Graphics Double Data Rate (GDDR6) SGRAM Standard
standard by JEDEC Solid State Technology Association, 11/01/2018
Embedded Multi-media card (e*MMC), Electrical Standard (5.1)
standard by JEDEC Solid State Technology Association, 02/01/2015
FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
standard by JEDEC Solid State Technology Association, 02/01/2014
Universal Flash Storage Host Controller Interface (UFSHCI), Unified Memory Extension
standard by JEDEC Solid State Technology Association, 03/01/2016
POD135 – 1.35 V PSEUDO OPEN DRAIN I/O
standard by JEDEC Solid State Technology Association, 07/01/2010
ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 12/01/2000
Low Power Double Data Rate 2 (LPDDR2)
standard by JEDEC Solid State Technology Association, 04/01/2011
HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
standard by JEDEC Solid State Technology Association, 01/01/2009
TEST BOARDS FOR AREA ARRAY SURFACE MOUNT PACKAGE THERMAL MEASUREMENTS
standard by JEDEC Solid State Technology Association, 07/01/2000
VIBRATION, VARIABLE FREQUENCY
standard by JEDEC Solid State Technology Association, 09/01/2016