JEDEC JESD2
DIGITAL BIPOLAR LOGIC PINOUTS FOR CHIP CARRIERS
standard by JEDEC Solid State Technology Association, 12/01/1982
NACE ASAE-ASABE B11 CGA ICC CTA
DIGITAL BIPOLAR LOGIC PINOUTS FOR CHIP CARRIERS
standard by JEDEC Solid State Technology Association, 12/01/1982
RECOMMENDED ESD-CDM TARGET LEVELS
standard by JEDEC Solid State Technology Association, 10/01/2009
VIBRATION, VARIABLE FREQUENCY
standard by JEDEC Solid State Technology Association, 06/01/2002
FBDIMM Architecture and Protocol
standard by JEDEC Solid State Technology Association, 01/01/2007
Embedded Multi-media card (e*MMC), Electrical Standard 5.0
standard by JEDEC Solid State Technology Association, 09/01/2013
LOW POWER DOUBLE DATA RATE (LPDDR) SDRAM STANDARD
standard by JEDEC Solid State Technology Association, 02/01/2010
FBDIMM: ADVANCED MEMORY BUFFER (AMB)
standard by JEDEC Solid State Technology Association, 03/01/2009
ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHED
standard by JEDEC Solid State Technology Association, 08/01/2008
Component Quality Problem Analysis and Corrective Action Requirements (Including Administrative Quality Problems)
standard by JEDEC Solid State Technology Association, 06/01/2012
CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST
standard by JEDEC Solid State Technology Association, 07/01/2013
DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2015
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
standard by JEDEC Solid State Technology Association, 10/01/2011