JEDEC JESD235
HIGH BANDWIDTH MEMORY (HBM) DRAM
standard by JEDEC Solid State Technology Association, 10/01/2013
NACE ASAE-ASABE B11 CGA ICC CTA
HIGH BANDWIDTH MEMORY (HBM) DRAM
standard by JEDEC Solid State Technology Association, 10/01/2013
Mechanical Shock – Device and Subassembly
standard by JEDEC Solid State Technology Association, 06/01/2019
GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS
standard by JEDEC Solid State Technology Association, 09/01/1998
SUBASSEMBLY MECHANICAL SHOCK
standard by JEDEC Solid State Technology Association, 11/01/2004
SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT
standard by JEDEC Solid State Technology Association, 11/01/2008
LEAD INTEGRITY
standard by JEDEC Solid State Technology Association, 05/01/2003
POWER MOSFET ELECTRICAL DOSE RATE TEST METHOD
standard by JEDEC Solid State Technology Association, 08/01/1989
MEASUREMENT AND REPORTING OF ALPHA PARTICLE AND TERRESTRIAL COSMIC RAY INDUCED SOFT ERRORS IN SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 10/01/2006
Addendum No. 2 to JESD79-3 – 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
Amendment by JEDEC Solid State Technology Association, 10/01/2011
DELPHI COMPACT THERMAL MODEL GUIDELINE
standard by JEDEC Solid State Technology Association, 10/01/2008
JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
standard by JEDEC Solid State Technology Association, 05/01/1999
FOUNDRY PROCESS QUALIFICATION GUIDELINES – BACKEND OF LINE (Wafer Fabrication Manufacturing Sites)
standard by JEDEC Solid State Technology Association, 09/01/2018