JEDEC JESD22-A101C
STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
standard by JEDEC Solid State Technology Association, 03/01/2009
NACE ASAE-ASABE B11 CGA ICC CTA
STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
standard by JEDEC Solid State Technology Association, 03/01/2009
ADDENDUM No. 3 to JESD24 – THERMAL IMPEDANCE MEASUREMENTS FOR VERTICAL POWER MOSFETS (DELTA SOURCE-DRAIN VOLTAGE METHOD)
Amendment by JEDEC Solid State Technology Association, 11/01/1990
RECOMMENDED ESD TARGET LEVELS FOR HBM QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2018
SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES
standard by JEDEC Solid State Technology Association, 07/01/2012
Procedure for Wafer-Level DC Characterization of Bias Temperature Instabilities
standard by JEDEC Solid State Technology Association, 12/01/2015
THERMAL SHOCK
standard by JEDEC Solid State Technology Association, 11/01/2016
DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 08/01/1993
Seriel Flash Discoverable Parameters (SFDP)
standard by JEDEC Solid State Technology Association, 11/01/2018
TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR MICROCOMPUTERS, MICROPROCESSORS, AND MEMORY INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 12/01/2002
MARKING PERMANENCY
standard by JEDEC Solid State Technology Association, 09/01/2004
SOLID STATE PRODUCTS REGISTRATION LIST(ORDER FROM TYPE ADMINISTRATION OFFICE)
standard by JEDEC Solid State Technology Association, 09/01/1986