JEDEC JESD51-4A
Thermal Test Chip Guideline (Wire Bond Type Chip)
standard by JEDEC Solid State Technology Association, 06/01/2019
NACE ASAE-ASABE B11 CGA ICC CTA
Thermal Test Chip Guideline (Wire Bond Type Chip)
standard by JEDEC Solid State Technology Association, 06/01/2019
STANDARD FOR MEASURING FORWARD SWITCHING CHARACTERISTICS OF SEMICONDUCTOR DIODES
standard by JEDEC Solid State Technology Association, 02/01/2000
THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
standard by JEDEC Solid State Technology Association, 12/01/2010
DOUBLE DATA RATE (DDR) SDRAM SPECIFICATION
standard by JEDEC Solid State Technology Association, 02/01/2008
PERFORMANCE TEST PROCEDURE FOR SOLAR CELLS AND CALIBRATION PROCEDURE FOR SOLAR CELL STANDARDS FOR SPACE VEHICLE SERVICE
standard by JEDEC Solid State Technology Association, 11/01/1969
FOUNDRY PROCESS QUALIFICATION GUIDELINES – FRONT END TRANSISTOR LEVEL (Wafer Fabrication Manufacturing Sites)
standard by JEDEC Solid State Technology Association, 09/01/2018
THERMAL MODELING OVERVIEW
standard by JEDEC Solid State Technology Association, 10/01/2008
Universal Flash Storage (UFS) Unified Memory Extention
standard by JEDEC Solid State Technology Association, 09/01/2013
STANDARD FOR THE MEASUREMENT OF CRE
standard by JEDEC Solid State Technology Association, 11/01/1967
Universal Flash Storage (UFS) Host Controller Interface
standard by JEDEC Solid State Technology Association, 08/01/2011
Addendum No. 1 to JESD79-3 – 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
Amendment by JEDEC Solid State Technology Association, 07/01/2010