IPC APEX-EXPO19

IPC APEX 2019 Technical Conference Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 04/11/2019

IPC 6901

Application Categories for Printed Electronics
standard by Association Connecting Electronics Industries, 07/01/2015

IPC 6801

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
standard by Association Connecting Electronics Industries, 01/01/2000

IPC 4563

Resin Coated Copper Foil for Printed Boards Guideline
standard by Association Connecting Electronics Industries, 11/01/2007

IPC HDBK-630

Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 06/01/2014

IPC CH-65A

Guidelines for Cleaning of Printed Boards and Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999

IPC 9631

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010

IPC 7530A

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
standard by Association Connecting Electronics Industries, 03/01/2017

IPC DRM-18H

Component Identification Training and Reference Guide
standard by Association Connecting Electronics Industries, 12/01/2007

IPC FC-232C

Specification for Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring
standard by Association Connecting Electronics Industries, 08/01/1992

IPC 6018CS

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Amendment by Association Connecting Electronics Industries, 07/01/2016

IPC 2225

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998