IEC 60317-38 Amd.1 Ed. 1.0 b:1997

Amendment 1 – Specifications for particular types of winding wires – Part 38: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200, with a bonding layer
Amendment by International Electrotechnical Commission, 12/22/1997

IEC 60286-1 Ed. 2.0 b:1997

Packaging of components for automatic handling – Part 1: Tape packaging of components with axial leads on continuous tapes
standard by International Electrotechnical Commission, 11/28/1997

IEC 60118-4 Ed. 3.0 b:2014

Electroacoustics – Hearing aids – Part 4: Induction-loop systems for hearing aid purposes – System performance requirements
standard by International Electrotechnical Commission, 12/11/2014

IEC 60050-815 Ed. 1.0 b:2000

International Electrotechnical Vocabulary – Part 815: Superconductivity
standard by International Electrotechnical Commission, 11/22/2000

IEC 60317-37 Amd.2 Ed. 1.0 b:1999

Amendment 2 – Specifications for particular types of winding wires – Part 37: Polyesterimide enamelled round copper wire, class 180, with a bonding layer
Amendment by International Electrotechnical Commission, 10/18/1999

IEC 60255-22-7 Ed. 1.0 b:2003

Electrical relays – Part 22-7: Electrical disturbance tests for measuring relays and protection equipment – Power frequency immunity tests
standard by International Electrotechnical Commission, 04/11/2003

IEC 60154-2 Ed. 2.0 b:1980

Flanges for waveguides. Part 2: Relevant specifications for flanges for ordinary rectangular waveguides
standard by International Electrotechnical Commission, 01/01/1980

IEC 60118-4 Amd.1 Ed. 3.0 b:2017

Amendment 1 – Electroacoustics – Hearing aids – Part 4: Induction-loop systems for hearing aid purposes – System performance requirements
Amendment by International Electrotechnical Commission, 11/09/2017

IEC 60050-714 Amd.2 Ed. 1.0 b:2017

Amendment 2 – International Electrotechnical Vocabulary (IEV) – Part 714: Switching and signalling in telecommunications
Amendment by International Electrotechnical Commission, 08/30/2017

IEC 60191-2Z Ed. 1.0 b:2000

Twenty-fourth supplement – Mechanical standardization of semiconductor devices – Part 2: Dimensions
standard by International Electrotechnical Commission, 09/29/2000

IEC 60286-6 Ed. 2.0 b:2004

Packaging of components for automatic handling – Part 6: Bulk case packaging for surface mounting components
standard by International Electrotechnical Commission, 02/05/2004