IEC 60205 Ed. 2.0 b:2001
Calculation of the effective parameters of magnetic piece parts
standard by International Electrotechnical Commission, 04/10/2001
NACE ASAE-ASABE B11 CGA ICC CTA
Calculation of the effective parameters of magnetic piece parts
standard by International Electrotechnical Commission, 04/10/2001
Amendment 2 – High-voltage switches. Part 2: High-voltage switches for rated voltages of 52 kV and above
Amendment by International Electrotechnical Commission, 08/19/1998
Hearing aids. Part 4: Magnetic field strength in audio-frequency induction loops for hearing aid purposes
standard by International Electrotechnical Commission, 01/01/1981
Electrical installations in ships. Part 203: System design – Acoustic and optical signals
standard by International Electrotechnical Commission, 12/30/1985
Corrigendum 1 – Environmental testing. Part 2: Tests. Test XA and guidance: Immersion in cleaning solvents
Corrigenda by International Electrotechnical Commission, 09/01/1981
Corrigendum 1 – Explosive atmospheres – Part 11: Equipment protection by intrinsic safety "i"
Corrigenda by International Electrotechnical Commission, 01/27/2012
Amendment 2 – Specifications for particular types of winding wires – Part 33: Glass-fibre wound resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 200
Amendment by International Electrotechnical Commission, 11/21/2005
Coaxial connectors used in nuclear laboratory instrumentation
standard by International Electrotechnical Commission, 04/30/2002
Environmental testing. Part 4: Information for specification writers – Test summaries
standard by International Electrotechnical Commission, 09/15/1987
Environmental testing – Part 2: Tests – Test Kb: Salt mist, cyclic (sodium, chloride solution)
standard by International Electrotechnical Commission, 02/07/1996
Corrigendum 1 – Measurements of the electrical properties of electronic tubes and valves. Part 8: Measurement of cathode heating time and heater warm-up time
Corrigenda by International Electrotechnical Commission, 07/01/1967
Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline packages (SOP)
standard by International Electrotechnical Commission, 08/30/2010